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Reactive sputtering of delta-ZrH2 thin films by high power impulse magnetron sputtering and direct current magnetron sputtering

机译:高功率脉冲磁控溅射和直流磁控溅射反应溅射ZrH2薄膜

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摘要

Reactive sputtering by high power impulse magnetron sputtering (HiPIMS) and direct current magnetron sputtering (DCMS) of a Zr target in Ar/H-2 plasmas was employed to deposit Zr-H films on Si(100) substrates, and with H content up to 61 at.% and O contents typically below 0.2 at.% as determined by elastic recoil detection analysis. X-ray photoelectron spectroscopy reveals a chemical shift of similar to 0.7 eV to higher binding energies for the Zr-H films compared to pure Zr films, consistent with a charge transfer from Zr to H in a zirconium hydride. X-ray diffraction shows that the films are single-phase delta-ZrH2 (CaF2 type structure) at H content greater thansimilar to 55 at.% and pole figure measurements give a 111 preferred orientation for these films. Scanning electron microscopy cross-section images show a glasslike microstructure for the HiPIMS films, while the DCMS films are columnar. Nanoindentation yield hardness values of 5.5-7 GPa for the delta-ZrH2 films that is slightly harder than the similar to 5 GPa determined for Zr films and with coefficients of friction in the range of 0.12-0.18 to compare with the range of 0.4-0.6 obtained for Zr films. Wear resistance testing show that phase-pure delta-ZrH2 films deposited by HiPIMS exhibit up to 50 times lower wear rate compared to those containing a secondary Zr phase. Four-point probe measurements give resistivity values in the range of similar to 100-120 mu Omega cm for the delta-ZrH2 films, which is slightly higher compared to Zr films with values in the range 70-80 mu Omega cm.
机译:采用高功率脉冲磁控溅射(HiPIMS)和直流磁控溅射(DCMS)在Ar / H-2等离子体中进行Zr靶的反应溅射,将Zr-H膜沉积在Si(100)衬底上,并使H含量增加弹性反冲检测分析法测定,其含量应小于等于61 at。%,O含量通常低于0.2 at。%。 X射线光电子能谱显示,与纯Zr膜相比,Zr-H膜的化学位移类似于0.7 eV,具有更高的结合能,这与氢化锆中Zr到H的电荷转移相一致。 X射线衍射表明,该膜为单相δ-ZrH2(CaF 2型结构),其H含量大于约55at。%,极坐标测量结果为这些膜提供了111种优选取向。扫描电子显微镜横截面图像显示了HiPIMS膜的玻璃状微结构,而DCMS膜则是柱状的。 δ-ZrH2薄膜的纳米压痕屈服硬度值为5.5-7 GPa,比Zr薄膜测定的5 GPa硬度稍高,摩擦系数在0.12-0.18的范围内,而在0.4-0.6的范围内用于Zr膜。耐磨性测试表明,与含次级Zr相的薄膜相比,由HiPIMS沉积的纯相delta-ZrH2薄膜的磨损率低50倍。四点探针测量得出的δ-ZrH2薄膜的电阻率值大约在100-120μΩcm的范围内,比Zr薄膜的电阻率值在70-80μΩcm的范围内略高。

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